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Visitors>Conference Info>Electronic Components, Devices & Industrial Equipment Exhibitor Presentation and Seminars

Electronic Components, Devices & Industrial Equipment Exhibitor Presentation and Seminars

10/4

CD1-03 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

Application Trend of Touch Monitor in NA, EU and China

Mr. Nobuhiko Hosohata
Touch Panel Systems K.K.
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CD2-03 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

Cell processor technology and its applications

Mr. Yoshio Masubuchi
Broadband System LSI Development Center Assistant to General Manager  
TOSHIBA CORPORATION Semiconductor Company
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CD1-04 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

OKI One Stop Solution for ZigBee

Mr. Koichi Tanimoto
Manager,
Wireless Business Unit, Telecom & Automotive LSI Marketing Department, LSI Business Division,
Silicon Solutions Company  
Oki Electric Industry Co., Ltd.
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CD2-04 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

A5 Automation -Serve Anyone Anywhere at Anytime with Any Service in Anyway

Mr. Ed Y. Zhang
Strategic Marketing  
Hometown Microsystems Inc.
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10/5

CD1-05 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

Programmable analog device "FPAA" for universal RFID tag reader

Mr. Keigo Kimura
SEMICONDUCTOR DIVISION  
OMRON Corporation
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CD2-05 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

PFC IC for Digital TV

Mr. Hitoshi Yoshioka
FAE Manager  
International Rectifier Japan Co., Ltd.
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CD1-06 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

EPSON TOYOCOM CORPORATION - The application proposal of Quartz Crystal MEMS and Thin-Film Technologies for industry and consumer market.

Mr. Mutsuo Hayashi
Development & Design Management Division General Manager  
EPSON TOYOCOM CORPORATION
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CD2-06 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

Bluetooth? ZigBee? DELIGIO!

Mr. KENJI YAMAZAKI
BUSINESS DEVELOPMENT  
Sensor & Wireless Solutions Inc.
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CD2-07 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

NAND Flash Memory Technology and Applicaion

Mr. Tatsuya Tanaka
File Memory Marketing & Application Engineering Group Manager  
TOSHIBA CORPORATION Semiconductor Company
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CD1-08 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

The latest signal measurement in Car electronics

Mr. Kiyoshi Watanabe
Applications Engineering  
Tektronix Japan, Ltd.
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CD2-08 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

  • Ultra-thin Planar Inductors
Mr. Kazuhiko Echizennya
Advanced Materials R&D Center  
JFE MINERAL COMPANY, LTD.
  • Lithium Nickelate-Cathode Materials for Lithium Battery
Mr. Yoshiaki Hamano
Advanced Materials R&D Center  
JFE MINERAL COMPANY, Ltd.
  • Piezoelectric Single Crystal PMN-PT
Mr. Yosuke Iwasaki
Advanced Materials R&D Center  
JFE MINERAL COMPANY, LTD.
  • Niobium Powder for Electrolytic Capacitor
Mr. Nobuyuki Sato
Advanced Materials R&D Center  
JFE MINERAL COMPANY, LTD.
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10/6

CD1-09 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

VoIP solution based on Intel and Microsoft products

Mr. Eiji Sato
Manager, Sales Group Sales dept. Yokohama Office  
Unidux Inc.
Sophia Systems
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CD2-09 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

Oki Engineering's evaluation and analysis technologies that support customers' reliable manufacturing processes
-New evaluation method for lead-free soldering

Mr. Yasunobu Iwai
Electronic Devices Evaluation Division  
OKI Engineering Co., Ltd.
Mr. Ryuichi Nakajima
Reliability Technology Division  
OKI Engineering Co., Ltd.
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CD1-10 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

Electronic component technology that underpins high-density mounting
Covering from chip resistors to LTCC circuit board

Mr. TOSHIYUKI SAKUMA
MONOZUKURI Initiative WAZAZUKURI Center  
KOA CORPORATION
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CD2-10 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

TOSHIBA Advanced Power Semiconductor Device

Mr. Koichi Murakami
TOSHIBA CORPORATION Semiconductor Company
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CD1-11 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

Web Publish Solution Technology

Mr. Hiroki Takei
Director  
iNEO Co., LTD.
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CD2-11 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

Advanced DYNASTRON(CMOS Image Sensor) for Cameraphone use

Mr. Motoyuki Maruyama
Imaging Device Marketing & Engineering Department Chief Specialist  
TOSHIBA CORPORATION Semiconductor Company
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CD1-12 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

The evaluation and verification of HDMI

Mr. Tetsuo Ogawa
Applications Engineering  
Tektronix Japan, Ltd.
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CD2-12 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

Introduction of Advanced Design Methodology for Transformer & System

Mr. Takayuki Sekisue
EM Product, Application Engineer  
Ansoft Japan K.K.
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10/7

CD1-13 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

Measuring electric current, voltage, and temperature using a shunt module

Mr. Sumio Honma
Sales Dept. Technical Support  
PCN Corporation
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CD2-13 11:00 - 12:00 International Exhibition Hall 7
This presentation has sold out.

Introduction to Linux
-CPZ series system construction examples with development kit-

Mr. Osamu Oue
R&D Division  
Interface Corporation
Mr. Eiji Makiga
R&D Division  
Interface Corporation
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CD1-14 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

Market Trend Analysis for TV and FPD

Mr. Hisakazu Torii / Mr. Yoshio Tamura
Japan Office  
Display Search
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CD2-14 12:30 - 13:30 International Exhibition Hall 7
This presentation has sold out.

Trends in semiconductors for digital TVs

Mr. Shigeru Yoshimochi
Technology Executive  
TOSHIBA CORPORATION Semiconductor Company
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CD2-15 14:00 - 15:00 International Exhibition Hall 7
This presentation has sold out.

Fuse Selection Guide

Mr. Kunihiko Imai
Technical Advisor, Pre-sales Application, Technical Div.  
Littelfuse K.K.
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CD1-16 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

RFID Measurement by Real Time Spectrum Analyzer

Mr. Shuji Nakatsuka
Applications Engineering  
Tektronix Japan, Ltd.
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CD2-16 15:30 - 16:30 International Exhibition Hall 7
This presentation has sold out.

Present condition of the EMI noise by the connector and cable which coped with HDMI(High Definition Multimedia Interface) only.

Mr. Atsushi Ono
CONNECTOR ENGINEERING DEPT. INTERFACE EQUIPMENT BUSINESS DIV. COMPONENT DEVICE BUSINESS HQ.  
MITSUMI ELECTRIC Co., LTD.
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